Vibrating piece, vibrator, oscillator, and electronic device

ABSTRACT

A vibrating piece in which a CI values ratio is maintained constant while minimizing the CI value of the fundamental wave, variations of the CI values between the vibrating piece devices are reduced even if the base is made short, and the entire vibrating piece can be made smaller.

CROSS REFERENCE TO RELATED APPLICATIONS

[0001] This application is a divisional patent application of U.S. Ser.No. 10/047,420 filed Jan. 14, 2002, claiming priority to JapaneseApplication No. 2001-006638 filed Jan. 15, 2001, all of which are herebyincorporated by reference.

FIELD OF THE INVENTION

[0002] The present invention relates to a vibrating piece formed of, forexample, a crystal, a vibrator having the vibrating piece, an oscillatorhaving the vibrator, and an electronic device having the vibrator.

DESCRIPTION OF THE RELATED ART

[0003] Generally, a tuning-fork-type crystal vibrating piece isconstructed as shown in, for example, FIG. 11.

[0004] More specifically, a tuning-fork-type crystal vibrating piece 10comprises a base 11, and two vibration arm sections 12 and 13 formed soas to protrude from the base 11. In these two arm sections 12 and 13,grooves 12 a and 13 a are formed on the obverse surface and the rearsurface thereof, as shown in FIG. 12.

[0005]FIG. 12 is a sectional view along the A-A′ line in FIG. 11. Asshown in FIG. 12, the vibration arm sections 12 and 13 are formed insuch a manner that their cross section is formed in nearly an H shapefrom the grooves 12 a and 13 a.

[0006] Furthermore, such grooves 12 a and 13 a are formed withexcitation electrodes 12 b and 13 b for causing these vibration armsections 12 and 13 to vibrate, respectively, as shown in FIG. 12.

[0007] Furthermore, as shown in FIG. 12, side excitation electrodes 12 cand 13 c are also formed on the sides of the vibration arm sections 12and 13, respectively.

[0008] Such a tuning-fork-type crystal vibrating piece 10 in nearly an Hshape has characteristics that, even if the size of the vibrating pieceis reduced, the vibration loss of the arm sections 12 and 13 is smalland the CI value (crystal impedance or equivalent series resistance) canbe minimized since the excitation electrodes 12 b and 13 b are providedwithin the grooves 12 a and 13 b.

[0009] For this reason, the tuning-fork-type crystal vibrating piece 10in nearly an H shape is used for, for example, in particular, a vibratorrequiring a high-precision performance even at a small size.

[0010] Such a tuning-fork-type crystal vibrating piece 10 hascharacteristics that it oscillates a signal at a frequency of afundamental wave by the vibration thereof, and at the same time alsooscillates a similar signal at a frequency of a harmonic wave.

[0011] If a device such as a vibrator picks up a signal of this harmonicwave by mistake for a signal of a frequency of a fundamental wave, thismay cause the device to malfunction.

[0012] Therefore, as a method of preventing such a situation, there is amethod using a CI value ratio as a reference. This CI value ratio issuch that the CI value of a harmonic wave is divided by the CI value ofa fundamental wave (CI value of harmonic wave/CI value of fundamentalwave).

[0013] More specifically, if the CI value of the harmonic wave becomesgreater than the CI value of the fundamental wave and the ratio of theseCI values becomes 1.0 or more, the oscillation of the signal at theharmonic wave is unlikely to occur. Thus, the risk that a device, etc.,erroneously picks up a signal of a harmonic wave becomes small, and ahigh-performance vibrating piece is formed.

[0014] In order to make the CI value ratio 1.0 or more in the mannerdescribed above, it is necessary to make the CI value of the harmonicwave greater. As a method therefor, it is known that the length (d1) ofthe excitation electrodes 12 b and 13 b formed in the grooves 12 a and13 a is made to be half, i.e., 0.5 L, with respect to the length (L) ofthe vibration arm sections 12 and 13 in FIG. 11.

[0015]FIG. 13 shows the relationship between the CI value of thefundamental wave, such as the above, and the CI value ratio. As shown inFIG. 13, the shorter the length (d1) of the excitation electrodes 12 band 13 b becomes with respect to the length (L) of the vibration armsections 12 and 13 the more the CI value of the fundamental wave isincreased, and thereby the CI value ratio is also increased.

[0016] In contrast, the longer the length (d1) of the excitationelectrodes 12 b and 13 b becomes with respect to the length (L) of thevibration arm sections 12 and 13 the more the CI value of thefundamental wave is decreased, and at the same time, also, the CI valueratio approaches 1.0. For example, when the length (d1) of theexcitation electrodes 12 b and 13 b becomes 60% of the length (L) of thevibration arm sections 12 and 13, the CI value ratio becomes 1.0 orless.

[0017] Therefore, in the manner described above, the length (d1) of theexcitation electrodes 12 b and 13 b is made to be about half of thelength (L) of the vibration arm sections 12 and 13.

[0018] As a result of the above, the CI value of the harmonic wave andthe CI value of the fundamental wave of the vibrating reed areincreased. However, at the same time, since the CI value of the harmonicwave becomes greater than the CI value of the fundamental wave, thedifference between their CI values is increased and thus the CI valueratio can be made to be 1.0 or more(see FIG. 13).

[0019] As a consequence, by making the CI value ratio to be 1.0 or morein this manner, a vibrator incorporating the tuning-fork-type crystalvibrating piece 10 is unlikely to erroneously pick up a signal of aharmonic wave, and a small high-performance vibrating reed is formed.

[0020] When the CI value of the harmonic wave is increased in the mannerdescribed above, the CI value of the fundamental wave is increased eventhough this increase is not so large as that of the harmonic wave.

[0021] In this fundamental wave, if the CI value becomes too great, theperformance of the vibrating piece may be caused to deteriorate. Forthis reason, since the CI value ratio is made to be 1.0 or more, the CIvalue of the harmonic wave cannot be made significantly greater.

[0022] However, if the CI value of the harmonic wave is increased tosuch a degree that the CI value of the fundamental wave is not increasedtoo much, it is not easy to make CI value ratio to be 1.0 or more.Therefore, a problem inevitably arises in that the CI value of thefundamental wave is increased more than necessary.

[0023] Furthermore, for even such a small tuning-fork-type crystalvibrating piece 10, there has been a demand for its furtherminiaturization in order to meet a demand for the miniaturization of adevice such as an electrical device in recent years.

[0024] The best way to meet such a demand for this miniaturization is;the longitudinal length (L1) of the base 11 in FIG. 11 is formedshorter, the length of the vibrating piece 10 becomes shorter as awhole, and thus the vibrating piece 10 becomes smaller. However, thereare problems described below.

[0025] That is, generally, unless the length of the base 11 is made tobe 40% or more of the length of the vibration arm sections 12 and 13,the CI value is not stabilized, and a problem arises in that theperformance of the vibrating piece is deteriorated.

[0026] More specifically, as shown in FIG. 12, when the thickness of thevibration arm sections 12 and 13 is denoted as D, the width of thevibration arm sections 12 and 13 is denoted as W, and the length of thevibration arm sections 12 and 13 is denoted as L, the frequency f of thetuning-fork-type crystal vibrating piece 10 must satisfy the followingequation:

f∝W/L²   Equation 1

[0027] That is, there is a relation that the shorter the length L of thevibration arm sections 12 and 13 of the vibrating piece 10 is, thenarrower the width W of the vibration arm sections 12 and 13 becomes.

[0028] Since the tuning-fork-type crystal vibrating piece 10 shown inFIG. 11 is miniaturized as described above and thus the length L of thevibration arm sections 12 and 13 is as short as 1.644 mm, the widththereof is very narrow, for example, 0.1 mm. Furthermore, the thicknessD of the vibration arm sections 12 and 13 is formed to be, for example,0.1 mm.

[0029] As shown in FIG. 13(a), in the arm sections 12 and 13 of thetuning-fork-type crystal vibrating piece 10, if the width W is large andthe thickness D is small, they perform a normal horizontal vibration, asindicated by the arrow B in the figure.

[0030] However, if the width W becomes smaller as described above, asshown in FIG. 14(b), the vibration contains components in the verticaldirection (the direction of the arrow C in the figure), and thevibration arm sections 12 and 13 vibrate in the direction indicated bythe arrow E in FIG. 14(b).

[0031] As is clear from FIG. 15, it can be seen that the verticalvibration component displacement quantity (nm) increases sharply whenthe width W/thickness D of the vibration arm sections 12 and 13 becomessmaller than 1.2.

[0032] When the vertical components of the vibration of the vibrationarm sections 12 and 13 are increased in this manner, this vibration ispropagated to the base 11 of the vibrating reed 10, and energy escapesfrom the bonding agent, etc., of the fixation area of the base 11 bywhich the vibrating piece 10 is fixed to a package, etc.

[0033] In this manner, when the vibration leaks to the base 11 andenergy escapes from the fixation area of the base 11, the vibration ofthe vibration arm sections 12 and 13 becomes unstable., and variationsof the CI values between the vibrating piece devices become large.

[0034] In order to prevent such leakage of the vibration of thevibration arm sections 12 and 13 and such escape of energy from thefixation area of the base 11, a length of 40% or more of the length L ofthe vibration arm sections 12 and 13 must be provided to the base 11 inthe manner described above. As a consequence, this has been an obstaclefor reducing the size of the vibrating piece 10 itself.

SUMMARY OF THE INVENTION

[0035] An object of the present invention is to provide a vibrating reedin which the ratio of CI values is maintained constant while minimizingthe CI value of the fundamental wave such that variations of the CIvalues between the vibrating piece devices are reduced even if the baseis made short, and the entire vibrating piece can be made smaller.

[0036] According to the present invention, preferably, vibrating piecesfrom (1) to (6) below are provided.

[0037] (1) A vibrating reed comprising: a base; and a vibration armsection formed so as to protrude from this base, a grooved portion beingformed in at least one of the obverse surface and the rear surface ofthe vibration arm section, wherein a cut section is formed in the base,and an electrode section is formed in a part of the grooved portion.

[0038] (2) A vibrating piece, wherein a grooved portion is formed in atleast one of the obverse surface and the rear surface of the vibrationarm section, and an electrode section is formed in a part of the groovedportion so that the CI value ratio (crystal impedance) of the vibratingpiece(CI value of the harmonic wave/CI value of the fundamental wave)becomes 1.0 or more.

[0039] (3) A vibrating piece, wherein the length of the electrodesection formed in a part of the grooved portion of the vibration armsection along the longitudinal direction is formed to be approximately45% to approximately 55% with respect to the length of the vibration armsection.

[0040] (4) A vibrating piece, wherein the electrode section is anexcitation electrode.

[0041] (5) A vibrating piece, wherein a fixation area for fixing thevibrating reed is provided in the base, and the cut section is providedin the base between the fixation area and the vibration arm section.

[0042] (6) A vibrating piece, wherein the vibrating reed is atuning-fork vibrating piece formed by a crystal which oscillates atapproximately 30 kHz to approximately 40 kHz.

BRIEF DESCRIPTION OF THE DRAWINGS

[0043]FIG. 1 is a schematic view of a tuning-fork-type crystal vibratingpiece according to a first embodiment of the present invention.

[0044]FIG. 2 is a sectional view along the line F-F′ in FIG. 1.

[0045]FIG. 3 shows the relationship between the CI value of thefundamental wave and the length of a groove.

[0046]FIG. 4 shows the dimensions of the tuning-fork-type crystalvibrating piece of FIG. 1.

[0047]FIG. 5 is a schematic perspective view showing the construction ofa cut section of a base of FIG. 4.

[0048]FIG. 6 is an illustration of a tuning-fork-type crystal vibratorof FIG. 4.

[0049]FIG. 7 is a schematic sectional view showing the construction of aceramic-packaged tuning-fork-type vibrator according to a secondembodiment of the present invention.

[0050]FIG. 8 is a schematic view showing the circuit blocks of aportable digital phone according to a third embodiment of the presentinvention.

[0051]FIG. 9 is a schematic sectional view showing the construction of atuning-fork crystal oscillator according to a fourth embodiment of thepresent invention.

[0052]FIG. 10 is a schematic sectional view showing the construction ofa cylinder-type tuning-fork vibrator according to a fifth embodiment ofthe present invention.

[0053]FIG. 11 is a schematic view showing a conventionaltuning-fork-type crystal vibrating piece.

[0054]FIG. 12 is a schematic sectional view along the line A-A′ in FIG.11.

[0055]FIG. 13 shows the relationship between the CI value of thefundamental wave and the CI value ratio.

[0056]FIG. 14(a) is an illustration of the vibration of a vibration armsection. FIG. 14(b) is another illustration of the vibration of thevibration arm section.

[0057]FIG. 15 shows the relationship between the vibration arm sectionand a vertical vibration component displacement quantity.

[0058]FIG. 16 is a schematic view showing a tuning-fork-type crystalvibrating piece 100 manufactured by a method of manufacturing thevibrating piece according to the first embodiment of the presentinvention.

[0059]FIG. 17 is a schematic sectional view along the line B-B′ in FIG.16.

[0060]FIG. 18 is a general flowchart showing electrode forming steps.

[0061]FIG. 19 includes schematic views showing steps in which anelectrode is formed in a tuning-fork arm.

[0062]FIG. 20 includes schematic views showing other steps in which anelectrode is formed in a tuning-fork arm.

[0063]FIG. 21 includes schematic views showing other steps in which anelectrode is formed in a tuning-fork arm.

DESCRIPTION OF THE EMBODIMENTS

[0064] Regarding each aspect of the invention of the above-described (1)to (6), preferably, the following embodiments are provided. However, thepresent invention is not limited to these embodiments.

[0065] A vibrator having a vibrating piece housed in a package, thevibrating reed comprising: a base; and a vibration arm section formed soas to protrude from this base, a grooved portion being formed in atleast one of the obverse surface and the rear surface of the vibrationarm section, wherein a cut section is formed in the base, and anelectrode section is formed in a part of the grooved portion.

[0066] A vibrator, wherein a grooved portion is formed in at least oneof the obverse surface and the rear surface of the vibration armsection, and an electrode section is formed in a part of the groovedportion so that the CI (crystal impedance) value ratio of the vibratingpiece (CI value of the harmonic wave/CI value of the fundamental wave)becomes 1.0 or more.

[0067] A vibrator, wherein the length of the electrode section formed ina part of the grooved portion of the vibration arm section along thelongitudinal direction is formed to be approximately 45% toapproximately 55% with respect to the length of the vibration armsection.

[0068] A vibrator, wherein the electrode section is an excitationelectrode.

[0069] A vibrator, wherein a fixation area for fixing the vibratingpiece is provided in the base, and the cut section is provided in thebase between the fixation area and the vibration arm section.

[0070] A vibrator, wherein the vibrating piece is a tuning-forkvibrating reed formed by a crystal which oscillates at approximately 30kHz to approximately 40 kHz.

[0071] A vibrator, wherein the package is formed in a box shape.

[0072] A vibrator, wherein the package is formed in a commonly-calledcylinder type.

[0073] An oscillator having a vibrating piece and an integrated circuithoused in a package, the vibrating piece comprising: a base; and avibration arm section formed so as to protrude from this base, wherein acut section is formed in the base, and an electrode section is formed ina part of the grooved portion, of the vibrating reed.

[0074] An electronic device using an vibrator which is connected to acontrol section, the vibrator having a vibrating piece housed in apackage, the vibrating piece comprising: a base; and a vibration armsection formed so as to protrude from this base, wherein a cut sectionis formed in the base, and an electrode section is formed in a part ofthe grooved portion, of the vibrating reed.

[0075] The embodiments of a vibrating reed of the present invention willbe described below in more detail with reference to the drawings.

[0076]FIG. 1 shows a tuning-fork-type crystal vibrating piece 100 whichis a vibrating piece according to a first embodiment of the presentinvention.

[0077] The tuning-fork-type crystal vibrating piece 100 is formed insuch a manner that a single quartz crystal is cut out so as to be formedas, for example, a commonly-called Z-plate crystal. Furthermore, sincethe tuning-fork-type crystal vibrating piece 100 shown in FIG. 1 is avibrating piece which generates a signal at, for example, 32.768 kHz, itis formed to be very small.

[0078] Such a tuning-fork-type crystal vibrating piece 100, as shown inFIG. 1, has a base 110. Two tuning-fork arms 121 and 122, which arevibration arm sections, are arranged in such a manner as to protrudeupward from the base 110 in the figure.

[0079] Furthermore, grooved portions 123 and 124 are formed on theobverse surfaces and the rear surfaces of the tuning-fork arms 121 and122, as shown in FIG. 1. Similarly, since the grooved portions 123 and124 are also formed on the rear surfaces of the tuning-fork arms 121 and122 (not shown in FIG. 1), these are formed into nearly an H shape inthe F-F′ sectional view of FIG. 1, as shown in FIG. 2.

[0080] In the grooved portions 123 and 124 formed in tuning-fork arms121 and 122 shown in FIG. 1, excitation electrodes 123 a and 124 a,which are electrode sections, are formed, as shown in FIGS. 1 and 2.

[0081] Furthermore, as shown in FIG. 2, side excitation electrodes 123 band 124 b are arranged on the side of the tuning-fork-type crystalvibrating piece 100.

[0082] In addition, another electrode 125 for supplying power isarranged in the tuning-fork-type crystal vibrating piece 100.

[0083] Since the excitation electrodes 123 a and 124 a are arranged inthe grooved portions 123 and 124, and the side excitation electrodes 123b and 124 b are arranged on the side thereof, when a voltage is appliedto the excitation electrodes 123 a and 124 a and the side excitationelectrodes 123 b and 124 b, an electric field is generated efficientlywithin the tuning-fork arms 123 and 124, and thus vibration is producedin a state in which the vibration loss of the tuning-fork arms 123 and124 is low and the CI value (crystal impedance or equivalent seriesresistance) is low.

[0084] This CI value indicates specifically a fundamental wave, and thefrequency is, for example, 32 kHz. As a result of minimizing the CIvalue of the fundamental wave, a high-performance vibrating piece isformed.

[0085] The length of the grooved portions 123 and 124 where theexcitation electrodes 123 a and 124 a are arranged is set to 0.7 L,which is the length of 70% with respect to the length (L) of thetuning-fork arms 121 and 122, as shown in FIG. 1.

[0086] The length of this 0.7 L is a length at which the CI value of thefundamental wave becomes lowest, as in FIG. 3 showing the relationshipbetween the CI value of the fundamental wave and the length of a groove.

[0087] In a part of the grooved portions 123 and 124 which are arrangedin such a length, as shown in FIGS. 1 and 2, excitation electrodes 123 aand 124 a are arranged.

[0088] The excitation electrodes 123 a and 124 a are not arranged overthe entire grooved portions 123 and 124, but rather, has a length of 50%with respect to the length (L) of the tuning-fork arms 121 and 122.

[0089] This ratio, as shown in FIG. 13, indicates an arrangement wherethe CI value ratio (CI value of the harmonic wave/CI value of thefundamental wave) becomes 1.0 or more. As a result of such anarrangement, since the CI value of the harmonic wave becomes greater inthe manner described above, and an erroneous oscillation becomesunlikely to occur at a harmonic wave, the vibrator incorporating thetuning-fork-type crystal vibrating piece 100 becomes susceptible to theoscillation of the fundamental wave.

[0090] When the tuning-fork arms 121 and 122 vibrate as described above,a possibility arises in which not only an oscillation at a fundamentalwave, but also an oscillation at a harmonic wave occurs.

[0091] However, according to this embodiment, the length of the groovedportions 123 and 124 is set to such a length (0.7 L) as that in whichthe CI value of the fundamental wave is decreased, and the length of theexcitation electrodes 123 a and 124 a is set to such a length (0.5 L) asthat in which the CI value ratio becomes 1.0 or more. Therefore, itbecomes possible to make the oscillation of the harmonic wave unlikelyto occur and to minimize the CI value of the fundamental wave.

[0092] That is, unlike a conventional tuning-fork-type crystal vibratingpiece 10, since the excitation electrodes 123 a and 124 a are notarranged in the entire grooved portions 123 and 124 and a portion wherethe excitation electrodes 123 a and 124 a are not arranged is providedin the grooved portions 123 and 124, such adjustment becomes possible.

[0093] In FIG. 1, below the tuning-fork arms 121 and 122 where thegrooved portions 123 and 124 and the excitation electrodes 123 a and 124a are arranged in this manner, the base 110 is arranged as describedabove.

[0094] The entirety of this base 110 is formed in nearly a plate shape.The length along the longitudinal direction in the figure is formed tobe, for example, 0.56 mm, as shown in FIG. 4.

[0095]FIG. 4 shows the dimensions, etc., of the tuning-fork-type crystalvibrating piece 100 of FIG. 1.

[0096] As shown in FIG. 4, the length of the tuning-fork arms 121 and122 arranged so as to protrude from the base 110 along the longitudinaldirection is formed to be, for example, 1.644 mm.

[0097] As a consequence, the length of the base 110 with respect to thetuning-fork arms 121 and 122 is about 34%. In comparison, theconventional tuning-fork-type crystal vibrating piece 10 is formed insuch a way that the length (L1) of the base 11 is 0.7 mm, the length (L)of the arm sections 12 and 13 is 1.644 mm. The length of the base 11becomes about 42.6% with respect to the length of the arm sections 12and 13, and this exceeds 40%.

[0098] In this manner, the length of the base 11 is made to be a lengthof 40% or more with respect to the length of the arm sections 12 and 13,and thus prevented are vibration leakage due to the vibration of thevertical components of the arm sections 12 and 13, and large variationsof the CI values between the vibrating piece devices.

[0099] In contrast, since the length of the base 110 of thetuning-fork-type crystal vibrating piece 100 of this embodiment isformed to be 34% with respect to the length of the tuning-fork arms 121and 122 as described above, in the construction similar to theconventional tuning-fork-type crystal vibrating reed 10, vibrationleakage due to the vibration of the vertical components of the armsections 12 and 13 occurs, and variations of the CI values between thevibrating piece devices become large.

[0100] However, in this embodiment, as shown in FIG. 4, two cut sections126 are provided on both sides of the base 110.

[0101]FIG. 5 shows this state. FIG. 5 is a schematic perspective viewshowing a state in which the cut sections 126 of the base 110 of FIG. 4are arranged.

[0102] As shown in FIG. 5, the cut sections 126 are formed in arectangular shape.

[0103] Such a cut section 126 is formed downward from the lower portionby 0.113 mm from the upper end portion of the base 110, as shown in FIG.4.

[0104]FIG. 6 shows the arrangement conditions of the cut section 126 inthe base 110.

[0105] In FIG. 6, the length from the bottom of the base 110 to theupper end of the base 110, specifically, to the crotch portion betweenthe two tuning-fork arms 121 and 122, is denoted as A1.

[0106] Then, the length from the bottom of the base 110 to the upper endportion of the cut section 126 is denoted as A2.

[0107] Furthermore, when the length from the bottom of the base 110 tothe lower end portion of the grooved portions 123 and 124 formed in thetuning-fork arms 121 and 122 is denoted as A3, the cut section 126 isformed in such a way that the length A3 is longer than the length A2.

[0108] Then, the construction is formed in such a way that the length ofA3 is formed to be the same as the length A1 or is longer than thelength of A1. Therefore, the grooved portions 123 and 124 are not formedon the bottom side of the base 110 from the root of the tuning-fork arms121 and 122.

[0109] From the above relation, the position of the cut section 126formed in the base 110 will always be at a portion lower than the lowerend portion of the grooved portions 123 and 124 of the tuning-fork arms121 and 122.

[0110] Therefore, the presence of the cut section 126 does not hinderthe vibration of the tuning-fork arm sections 121 and 122.

[0111] Furthermore, the portion indicated with oblique lines in FIG. 6is a fixation area 111 which is actually fixed when the tuning-fork-typecrystal vibrating piece 100 is fixed in a package. A4 indicates thedistance between the upper end portion of the fixation area 111 and thebottom of the base 110.

[0112] The positional relationship between the fixation area 111 and thecut section 126 is such that the length A2 becomes always longer thanthe length A4.

[0113] Therefore, since the upper end portion of the cut section 126 isalways positioned at a portion higher than the fixation area 111 in FIG.4, the cut section 126 does not exert an influence on the fixation area111, and thus no adverse influence is exerted on the fixed state of thetuning-fork-type crystal vibrating piece 100 with respect to thepackage.

[0114] As described above, the cut sections 126 provided in the base 110are provided at positions where no adverse influence is exerted on thevibration of the tuning-fork arms 121 and 122 of the tuning-fork-typecrystal vibrating piece 100. Furthermore, the cut sections 126 are alsoprovided at positions where no adverse influence is exerted on the fixedstate of the tuning-fork-type crystal vibrating piece 100 with respectto the package. The cut sections 126 provided at such positions areprovided on the base 110 side below the position of the grooved portions123 and 124 of the tuning-fork arms 121 and 122. As a consequence, thecut section 126 makes it difficult for leakage vibration leaking fromthe grooved portions 123 and 124 due to the vibration of the tuning-forkarms 121 and 122 to propagate to the fixation area 111 of the base 110.

[0115] Therefore, it becomes unlikely that the leakage vibrationpropagates to the fixation area 111 and energy escape occurs. Thus, anincrease in variations of the CI values between the vibrating piecedevices can be effectively prevented.

[0116] As described above, since variations of the CI values between thevibrating piece devices can be reduced, it is not necessary to make thelength of the base 11 to be 40% or more of the length of the armsections 12 and 13 as in the conventional tuning-fork-type crystalvibrating piece 10.

[0117] In this embodiment, as shown in FIG. 1, even if the length of thebase 110 of the tuning-fork-type crystal vibrating piece 100 is formedso as to be 34% with respect to the length of the tuning-fork arms 121and 122 in the manner described above, vibration leakage due to thevibration of the vertical components of the tuning-fork arms 121 and 122becomes unlikely to occur, and variations of the CI values between thevibrating piece devices are reduced. As a result, the length of the base110 can be shortened, and the size of the tuning-fork-type crystalvibrating piece 100 can be reduced.

[0118] In this embodiment, the length of the base 110 can be made to be0.56 mm as shown in FIG. 4, and thus it can be considerably smaller than0.7 mm, which is the length (L1) of the length of the base 11 shown inFIG. 12 of the conventional tuning-fork-type crystal vibrating piece 10.

[0119] The respective widths of the tuning-fork arms 121 and 122 areformed to be 0.1 mm as shown in FIG. 4. The reason why the arm widths ofthe tuning-fork arms 121 and 122 are formed considerably narrower inthis manner is that the length (L) of the tuning-fork arms 121 and 122are shortened as stated in detail in the description [f∝W/L²] which isthe above-described equation 1.

[0120] More specifically, in order to shorten the length of the,tuning-fork arms 121 and 122 to be 1.644 mm as shown in FIG. 4, the armwidth must be 0.1 mm based on equation 1 described above, and therefore,the arm width is made to be 0.1 mm.

[0121] However, if the arm width of the tuning-fork arms 121 and 122 ismade to be 0.1 mm in this manner, there is a risk that the CI valuebecomes large.

[0122] Therefore, in this embodiment, to suppress an increase of the CIvalue, as shown in FIG. 1, the grooved portions 123 and 124 of thelength 0.7 L are provided on the obverse surface and the rear surface ofthe tuning-fork arms 121 and 122 in the manner described above, so that,as shown in FIG. 3, the CI value becomes considerably low.

[0123] When the tuning-fork-type crystal vibrating piece 100 constructedas described above is placed within a package and a voltage is applied,the tuning-fork arms 121 and 122 vibrate. At this time, both the armwidths and the thicknesses of the tuning-fork arms 121 and 122 areformed to be 0.1 mm in the manner described above.

[0124] As a consequence, although the vibration of the verticalcomponents is produced as shown in FIG. 14(b), the vibration is lessenedin the cut section 126 of the base 110. Thus, the following can beprevented that energy escapes from the fixation area 111 of the base110, vibration loss occurs, and the variations of the CI values betweenthe vibrating piece devices are increased.

[0125] Furthermore, since the cut section 126 does not hinder thevibration of the tuning-fork arms 121 and 122 and is arranged at aposition of the base 110 where no influence is exerted on the fixationof the fixation area 111 of the base 110, no adverse influence isexerted on the vibration of the tuning-fork arms 121 and 122 and on thefixation of the tuning-fork-type crystal vibrating piece 100 withrespect to the package.

[0126] Furthermore, since the length of the base 110 can be shortenedthan the conventional vibrating piece, the size of the tuning-fork-typecrystal vibrating piece 100 can be reduced, making it possible to reducethe size of a vibrator, etc., incorporating such a vibrating piece.

[0127] For the tuning-fork-type crystal vibrating piece 100 which isformed smaller, since the CI value of the fundamental wave is set to bevery low as described above, and the CI value ratio is set to 1.0 ormore, a very small vibrating reed having a higher precision is formed.

[0128]FIG. 7 shows a ceramic-packaged tuning-fork-type vibrator 200which is a vibrator according to a second embodiment of the presentinvention.

[0129] This ceramic-packaged tuning-fork-type vibrator 200 uses thetuning-fork-type crystal vibrating piece 100 of the above-describedfirst embodiment. Accordingly, the same reference numerals are used forthe construction, the operation, etc., of the tuning-fork-type crystalvibrating piece 100, and description thereof is omitted.

[0130]FIG. 7 is a schematic sectional view showing the construction ofthe ceramic-packaged tuning-fork-type vibrator 200. As shown in FIG. 7,the ceramic-packaged tuning-fork-type vibrator 200 has a box-shapedpackage 210 having a space therein.

[0131] This package 210 comprises a base 211 on the bottom thereof. Thisbase 211 is formed by, for example, ceramic such as alumina.

[0132] A sealing section 212 is provided on the base 211, with thesealing section 212 being formed from the same material as that of thebase 211. Furthermore, a lid member 213 is placed in the upper endportion of this sealing section 212, and the base 211, the sealingsection 212, and the lid member 213 form a hollow box.

[0133] An electrode 214 on the-package side is provided on the base 211of the package 210 formed in this manner. A fixation area 111 of thebase 110 of the tuning-fork-type crystal vibrating piece 100 is fixedonto the electrode 214 on the package side via a conductive bondingagent, etc.

[0134] Since this tuning-fork-type crystal vibrating piece 100 is formedas shown in FIG. 1, the CI value of the fundamental wave is minimized,and the CI value ratio is set to 1.0 or more. Additionally, it is small,and variations of the CI values between the vibrating piece devices aresmall. Therefore, the ceramic-packaged tuning-fork-type vibrator 200incorporating this vibrating piece also becomes a small high-performancevibrator in which variations of the CI values between the vibratingpiece devices are small.

[0135]FIG. 8 is a schematic view showing a portable digital phone 300which is an electronic device according to a third embodiment of thepresent invention.

[0136] This portable digital phone 300 uses the ceramic-packagedtuning-fork-type vibrator 200 of the above-described second embodimentand the tuning-fork-type crystal vibrating piece 100.

[0137] Accordingly, the same reference numerals are used for theconstruction, the operation, etc., of the ceramic-packagedtuning-fork-type vibrator 200 and the tuning-fork-type crystal vibratingpiece 100, and description thereof is omitted.

[0138]FIG. 8 shows the circuit blocks of the portable digital phone 300.As shown in FIG. 8, in a case where transmission is performed by theportable digital phone 300, when the user inputs his/her voice into amicrophone, the signal passes through pulse-width modulation/codingblocks, modulator/demodulator blocks, a transmitter, and an antennaswitch, and is transmitted from an antenna.

[0139] On the other hand, a signal transmitted from the telephone ofanother person is received by the antenna, passes through the antennaswitch and the receiving filter, and is input to themodulator/demodulator blocks from the receiver. Then, the modulated ordemodulated signal passes through the pulse-width modulation/codingblocks and is output from the speaker as sound.

[0140] A controller for controlling the antenna switch, themodulator/demodulator blocks, etc., among the above is provided.

[0141] There is a demand for this controller to have a high precisionbecause it controls, in addition to the above, the LCD which is adisplay section, the keys which are a section for inputting numbers, theRAM, the ROM, etc. There is also a demand for the portable digital phone300 to become smaller.

[0142] As a vibrator meeting such a demand, the above-describedceramic-packaged tuning-fork-type vibrator 200 is used.

[0143] Since this ceramic-packaged tuning-fork-type vibrator 200 has thetuning-fork-type crystal vibrating piece 100 shown in FIG. 1, theceramic-packaged tuning-fork-type vibrating piece 200 has a low CIvalue, has a CI value ratio which is set to 1.0 or more, has smallvariations of the CI values between the vibrating piece devices, has ahigh precision, and becomes smaller. Therefore, the portable digitalphone 300 incorporating this ceramic-packaged tuning-fork-type vibrator200 becomes also a small high-performance portable digital phone inwhich variations of the CI values between the vibrating piece devicesare small.

[0144]FIG. 9 shows a tuning-fork crystal oscillator 400 which is anoscillator according to a fourth embodiment of the present invention.

[0145] The construction of this digital tuning-fork crystal oscillator400 is similar in many portions to the ceramic-packaged tuning-fork-typevibrator 200 of the above-described second embodiment. Accordingly, thesame reference numerals are used for the construction, the operation,etc., of the ceramic-packaged tuning-fork-type vibrator 200 and thetuning-fork-type crystal vibrating piece 100, and description thereof isomitted.

[0146] The tuning-fork-type crystal oscillator 400 shown in FIG. 9 isformed in such a manner that an integrated circuit 410 is arranged belowthe tuning-fork-type crystal vibrating piece 100 of the ceramic-packagedtuning-fork-type vibrator 200 shown in FIG. 9 and on the base 211, asshown in FIG. 10.

[0147] More specifically, in the tuning-fork crystal oscillator 400,when the tuning-fork-type crystal vibrating piece 100 arranged thereinvibrates, the vibration is input to the integrated circuit 410, andthereafter, as a result of extracting a predetermined frequency signal,the tuning-fork crystal oscillator 400 functions as an oscillator.

[0148] That is, since the tuning-fork-type crystal vibrating piece 100housed in the tuning-fork crystal oscillator 400 is formed as shown inFIG. 1, the CI value is minimized, the CI value ratio is set to 1.0 ormore, the size is reduced, and variations of the CI values between thevibrating piece devices are small. Therefore, the digital tuning-forkcrystal oscillator 400 incorporating this vibrating piece becomes also asmall high-performance oscillator in which variations of the CI valuesbetween the vibrating piece devices are small.

[0149]FIG. 10 shows a cylinder-type tuning-fork vibrator 500 which is avibrator according to a fifth embodiment of the present invention.

[0150] This cylinder-type tuning-fork vibrator 500 uses thetuning-fork-type crystal vibrating piece 100 according to the firstembodiment. Accordingly, the same reference numerals are used for theconstruction, the operation, etc., of the tuning-fork-type crystalvibrating piece 100, and description thereof is omitted.

[0151]FIG. 10 is a schematic view showing the construction of thecylinder-type tuning-fork vibrator 500.

[0152] As shown in FIG. 10, the cylinder-type tuning-fork vibrator 500has a metal cap 530 for housing the tuning-fork-type crystal vibratingpiece 100 therein. This cap 530 is press-fitted into a stem 520 so thatthe inside thereof is maintained in a vacuum state.

[0153] Furthermore, two leads 510 for holding the tuning-fork-typecrystal vibrating piece 100 in nearly an H shape, housed in the cap 530are arranged.

[0154] When an electric current is externally applied to such acylinder-type tuning-fork vibrator 500, the tuning-fork arms 121 and 122of the tuning-fork-type crystal vibrating piece 100 vibrate, and itfunctions as a vibrator.

[0155] At this time, since the tuning-fork-type crystal vibrating piece100 is formed as shown in FIG. 1, the CI value is minimized, the CIvalue ratio is set to 1.0 or more, the size is reduced, and variationsof the CI values between the vibrating piece devices are small.Therefore, the cylinder-type tuning-fork vibrator 500 incorporating thisvibrating piece also becomes a small high-performance vibrator in whichvariations of the CI values between the vibrating piece devices aresmall.

[0156] Although in each of the above-described embodiments, adescription is given by using a tuning-fork-type crystal vibrator of32.738 kHz as an example, it is clear that a tuning-fork-type crystalvibrator of 15 to 155 kHz can also be used.

[0157] It is clear that the tuning-fork-type crystal vibrating piece 100according to the above-described embodiments can be used for not onlythe above-described examples, but also for other electronic devices,mobile information terminals, built-in-clock devices such astelevisions, video devices, radio cassette recorders, or personalcomputers, and clocks.

[0158] In addition, the present invention is not limited to theabove-described embodiments, and various modifications are possiblewithin the scope of the claims. A part of the construction of theabove-described embodiments can be omitted, or can be changed to adesired combination which is not described in the foregoing.

[0159] The tuning-fork-type crystal vibrating piece 100 according tothis embodiment is constructed as described above. The method ofmanufacturing the tuning-fork-type crystal vibrating piece 100 will bedescribed below.

[0160] Initially, by etching a crystal substrate, a tuning-fork-typecrystal vibrating piece in a state in which the electrode of FIG. 16 isnot formed is formed. Thereafter, an electrode is formed in thistuning-fork-type crystal vibrating piece.

[0161] A step of forming an electrode will be described centering ontuning-fork arms 120 and 130. Since the tuning-fork arm 130 is the sameas the tuning-fork arm 120, in the following, only the tuning-fork arm120 will be described. FIG. 18 is a general flowchart showing electrodeforming steps. FIG. 19 includes schematic views showing steps in whichan electrode is formed in the tuning-fork arm 120.

[0162] First, FIG. 19(a) is a schematic sectional view along the B-B′line in FIG. 16, of the tuning-fork arm 120 of the tuning-fork-typecrystal vibrating piece in a state in which an outside shape is formedby the etching.

[0163] As shown in FIG. 19(a), grooved portions 120 a and 130 a areformed on the obverse surface 120 e and the rear surface 120 f of thetuning-fork arm 120 (grooved-portion forming step).

[0164] An electrode film 150, which is a metal film, is formed bysputtering, etc. on the entire vibrating piece, including thetuning-fork arm 120 (metal film forming step, ST1 in FIG. 18).

[0165]FIG. 19(b) shows this state. The electrode film 150 shown in FIG.19 is formed in such a manner that a lower layer is made from Cr and thethickness is, for example, 100 Å to 1000 Å. Furthermore, an upper layeris made from Au and the thickness is, for example, 500 Å to 1000 Å.

[0166] After the electrode film 150 is formed on the entire surface inthis manner, as shown in ST2 of FIG. 18, a photoresist is sprayed in afine spray form so that it is coated on the entire surface of theelectrode film 150. That is, as shown in FIG. 19(c), a photoresist film151 is formed (photoresist layer forming step).

[0167] This photoresist is a compound based on a resin which isphotosensitive to ultraviolet light and has fluidity. Therefore, thephotoresist is coated by being sprayed in a fine spray form using, forexample, a spray.

[0168] The thickness of the photoresist film 151 is, for example, 1 to 6μm.

[0169] Next, as shown in ST3 in FIG. 18, a photoresist pattern isformed. More specifically, ultraviolet rays are radiated onto thephotoresist film 151 via a mask (not shown) which covers a portionexcluding the electrode formation portion (oblique lines) of FIG. 16(exposure), it is removed using a developing solution, and afterundergoing a heating step, etc., the photoresist film 151 is solidified.

[0170] As a result, a photoresist pattern 152 in a shape correspondingto the electrode formation portion (oblique lines) of FIG. 16 is formed.

[0171] At this time, in the photoresist pattern 152, a portion where thephotoresist film 151 is not formed is formed at a spacing W1 forpreventing a short-circuit in FIGS. 16 and 17, specifically, at a widthof, for example, 15 μm.

[0172] The photoresist is coated onto the electrode film 150 in themanner described above. It is necessary to perform a coating so as tocover the edge portion (the arrow E in the figure) which is a cornerportion of the tuning-fork arm 120 of FIG. 19(a). At this time, the edgeportion E is covered efficiently when the photoresist to be coated is ina particulate form.

[0173] However, if the photoresist is coated in a state in whichparticulate matter is contained in this manner, the outside shape of thephotoresist pattern 152 after the photoresist is developed is, to beaccurate, not a nearly straight-line, but formed into a nearly wavy linealong the outside shape of the particles.

[0174] If the line of the outside shape of the photoresist pattern 152is nonuniform in this manner, in a case where a very small spacing suchas the short-circuit prevention spacing W1 of 15 μm is to be formed,there is a risk that the spacing is not maintained partially.

[0175] Since the portion where the spacing is not maintained becomes aportion which is not etched, there is a risk that the electrodes areshort-circuited with each other.

[0176] For this reason, in this embodiment, as shown in ST4 of FIG. 18,laser radiation is performed (pattern shape adjustment step). Morespecifically, this is performed on the short-circuit prevention spacingW1 of the obverse surface 120 e of the arm of the tuning-fork arm 120 inFIG. 16, which is a shape of a part of the photoresist pattern 152.

[0177] More specifically, as shown in FIG. 20(a), the outside shape ofthe photoresist pattern 152 becomes nonuniform, and when etching isperformed by using this photoresist pattern as a mask, in order that agroove electrode 120 b and a side electrode 120 d to be formed are notshort-circuited with each other, the outside shape of the photoresistpattern 152 is adjusted by a laser so that the short-circuit preventionspacing W1 can be provided by, for example, 15 μm.

[0178] For this laser, for example, a YAG laser is used. In particular,if a third harmonic wave is used, the outside shape of the photoresistpattern 152 can be adjusted more accurately.

[0179] In this manner, since the laser is radiated after the photoresistpattern 152 is formed, it is not necessary to radiate a laser inside ayellow room where, particularly, the exposure of the photoresist isprevented, and thus the manufacturing cost can be reduced.

[0180] Furthermore, the radiation of the laser is separately performedon the short-circuit prevention spacing W1 of the obverse surface 120 eof the arm of the tuning-fork arm 120 and on the short-circuitprevention spacing W1 of the rear surface 120 f of the arm thereof, asshown in FIGS. 20(a) and 20(b).

[0181] However, in addition, as shown in FIG. 20(c), both the armobverse surface 120 e and the arm rear surface 120 f can also beprocessed simultaneously using the laser.

[0182] In this case, since the number of production steps can bereduced, the production cost can also be reduced.

[0183] After the photoresist pattern 152 is accurately formed by thelaser in this manner, the process proceeds to the etching step of ST5 ofFIG. 18 (electrode film forming step).

[0184] More specifically, the electrode film 150 is removed by etchingby using the photoresist pattern 152 as a mask.

[0185]FIG. 21(a) shows a state in which the electrode film 150 isremoved by etching. As shown in FIG. 21(a), according to themanufacturing method of this embodiment, the short-circuit preventionspacing W1 can be accurately provided.

[0186] Next, if the photoresist pattern 152 is removed in the resistpeeling-off step of ST6 of FIG. 18, as shown in FIG. 21(b), the grooveelectrode 120 b and the side electrode 120 d are accurately formed(photoresist pattern peeling-off step).

[0187] At this time, a part of the electrode film 150 is melted by laserradiation shown in FIG. 17 in the above-described laser radiation step(ST3), and a part of this melted electrode film 150 is removed togetherwith the photoresist pattern 152. Therefore, the short-circuitprevention spacing W1 can be formed more accurately.

[0188] At this time, regarding the entire tuning-fork-type crystalvibrating piece 100, as shown in FIG. 16, a base electrode 140 a, etc.,is formed in a predetermined shape, and the electrode arrangement of thetuning-fork-type crystal vibrating piece 100 is terminated.

[0189] In the tuning-fork-type crystal vibrating piece 100 which ismanufactured in this manner, the short-circuit prevention spacing W1 ofthe obverse surfaces 120 e and 130 e and the rear surfaces 120 f and 130f of the arms of the tuning-fork arms 120 and 130 is accuratelymaintained at, for example, 15 μm, it is possible to effectively preventthe groove electrodes 120 b and 130 b from being short-circuited withthe side electrodes 120 d and 130 d, and a tuning-fork-type crystalvibrating piece in which a failure is unlikely to occur is formed.

[0190] As has thus been described, according to the present invention,it is possible to provide a vibrating piece in which the CI value ratiois maintained constant while minimizing the CI value of the fundamentalwave, variations of the CI values between the vibrating piece devicesare reduced even if the base is made short, and the entire vibratingpiece can be made smaller, a vibrator having the vibrating piece, anoscillator comprising the vibrator, and an electronic device comprisingthe vibrator.

What is claimed is: 1) A vibrating piece comprising: a base; and avibration arm section formed so as to protrude from this base, a groovedportion being formed in at least one of the obverse surface and the rearsurface of said vibration arm section, wherein a cut section is formedin said base, and an electrode section is formed in a part of saidgrooved portion. 2) A vibrating piece according to claim 1, wherein agrooved portion is formed in at least one of the obverse surface and therear surface of said vibration arm section, and an electrode section isformed in a part of said grooved portion so that-the CI value ratio(crystal impedance) of said vibrating piece (CI value of the harmonicwave/CI value of the fundamental wave) becomes 1.0 or more. 3) Avibrating piece according to claim 2, wherein the length of theelectrode section formed in a part of said grooved portion of saidvibration arm section along the longitudinal direction is formed to beapproximately 45% to approximately 55% with respect to the length ofsaid vibration arm section. 4) A vibrating piece according to claim 1,wherein said electrode section is an excitation electrode. 5) Avibrating piece according to claim 1, wherein a fixation area for fixingthe vibrating piece is provided in said base, and said cut section isprovided in the base between the fixation area and said vibration armsection. 6) A vibrating piece according to claim 1, wherein saidvibrating piece is a tuning-fork vibrating piece formed by a crystalwhich oscillates at approximately 30 kHz to approximately 40 kHz. 7) Avibrator having a vibrating piece housed in a package, said vibratingpiece comprising: a base; and a vibration arm section formed so as toprotrude from this base, a grooved portion being formed in at least oneof the obverse surface and the rear surface of said vibration armsection, wherein a cut,section is formed in said base, and an electrodesection is formed in a part of said grooved portion. 8) A vibratoraccording to claim 7, wherein a grooved portion is formed in at leastone of the obverse surface and the rear surface of said vibration armsection, and an electrode section is formed in a part of said groovedportion so that the CI (crystal impedance) value ratio of said vibratingpiece (CI value of the harmonic wave/CI value of the fundamental wave)becomes 1.0 or more. 9) A vibrator according to claim 8, wherein thelength of the electrode section formed in a part of said grooved portionof said vibration arm section along the longitudinal direction is formedto be approximately 45% to approximately 55% with respect to the lengthof said vibration arm section. 10) A vibrator according to claim 7,wherein said electrode section is an excitation electrode. 11) Avibrator according to claim 7, wherein a fixation area for fixing thevibrating piece is provided in said base, and said cut section isprovided in the base between the fixation area and said vibration armsection. 12) A vibrator according to claim 7, wherein said vibratingpiece is a tuning-fork vibrating piece formed by a crystal whichoscillates at approximately 30 kHz to approximately 40 kHz. 13) Avibrator according to claim 7, wherein said package is formed in a boxshape. 14) A vibrator according to claim 7, wherein said package isformed in a commonly-called cylinder type. 15) An oscillator having avibrating piece and an integrated circuit housed in a package, saidvibrating piece comprising: a base; and a vibration arm section formedso as to protrude from this base, wherein a cut section is formed insaid base, and an electrode section is formed in a part of said groovedportion.